Conduction. Convection.
Radiation.
Thermal design.
Heat transfer reference for thermal management. Conduction, convection, radiation modes. Material thermal conductivity, heat sinks, thermal interface materials.
Key principles.
Solid heat flow
Thermal conductivity W/m·K. Copper 401, aluminum 235, steel 50.
Fluid cooling
Air natural convection h ~ 5-25 W/m²·K. Forced ~ 25-250.
Thermal emission
Radiation per Stefan-Boltzmann. Significant at high temperature.
TIM critical
TIM (thermal interface material) reduces contact resistance.
Surface area
Fin area + airflow rate determines cooling capacity.
Heat pipes
Heat pipes use evaporation/condensation for high heat flux.
FAQ
Thermal conductivity ranking?
Diamond 2200, copper 401, aluminum 235, steel 50, plastic 0.2 W/m·K.
Air vs liquid cooling?
Liquid 5-10× more capacity than air at same volume. Liquid for high-power.
Heat sink design?
Surface area dominant. Fin pitch 2-5 mm forced air, 5-10 mm natural.
Thermal interface material?
Necessary for heat sink contact. Pads, paste, phase-change materials. Lower thermal resistance.
Radiation enhancement?
Black anodize emissivity ~0.9 vs polished aluminum ~0.05. Big improvement at high temp.
Heat pipe vs solid?
Heat pipe ~5000 W/m·K equivalent vs copper 401 W/m·K. 10× better for spreading.
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