Industry · Semiconductor

Wafer handling.
Vacuum chambers.
ASML Tier-2.

CNC manufacturing for semiconductor fab equipment. ASML, Applied Materials, Lam Research, Tokyo Electron Tier-2/3 supply chain. Vacuum chamber components, wafer handling hardware, lithography optical mounts, precision stages. UHV clean, ESD-safe, Invar 36 precision.

Semiconductor Quote Vacuum chambers

UHV clean ESD-safe materials Invar 36 precision Ultra-pure

01 · Semiconductor equipment

Semiconductor fab equipment categories.

Different semiconductor tools have different manufacturing requirements. Lithography prioritizes precision. Etch prioritizes chemical resistance. Deposition prioritizes cleanliness.

Lithography hardware

Invar 36 · 6061

Photolithography stepper/scanner components. Precision stages, optical mounts, reticle handling. Sub-micron tolerance.

Wafer handling

PEEK-CF30 · 316L

Wafer transport hardware — end effectors, robot arm components. ESD-safe materials required.

Vacuum chambers

316L electropolished

Deposition and etch chamber bodies. Electropolished interior, CF flange interfaces, helium leak tested.

Process chamber internals

6061 · ceramics

Showerheads, chamber furniture, specialty process hardware. High-purity, particle-controlled.

CMP equipment

Aluminum · polyurethane

Chemical mechanical polishing tool hardware. Slurry-resistant materials.

Test probe hardware

Kovar · BeCu

Probe station components, probe card hardware. Low-CTE for stable measurements.

Ion implant hardware

316L · Ti

Ion implanter components, beam line hardware, source hardware.

Precision stages

Al / granite

Ultra-precision XY stages, piezo positioning hardware. Sub-nanometer positioning.

Electron optics

Mu-metal · Al

Electron microscope and e-beam lithography components. Magnetic shielding considerations.

02 · Semiconductor customers

Semiconductor customers we serve.

ASML supply chain

ASML lithography Tier-2/3 — optical mounts, precision hardware, stage components

Applied Materials

Applied Materials Tier-2/3 — deposition and etch tool components

Lam Research

Lam Research etch tool supply chain

Tokyo Electron

TEL equipment components

KLA inspection

KLA-Tencor inspection equipment components

Semiconductor fabs

Direct support of fab infrastructure (TSMC, Samsung, Intel Foundries)

Chinese semiconductor

SMIC, YMTC, Hua Hong — Chinese semiconductor equipment supply chain

Fab tool startups

Semiconductor equipment startup supply chain support

Research institutions

Universities and research labs with semiconductor research needs

FAQ

Semiconductor questions.

Semiconductor parts must be extremely clean — particles, ionic contamination, outgassing all critical. Our semiconductor workflow: dedicated machining area (no cross-contamination), ultrasonic clean in multiple stages (DI water + IPA + specialty solutions), packaging in class 1000 / ISO 6 clean environment, double-bagged delivery. For critical semiconductor parts, individual particle counts documented.

Semiconductor handling requires ESD-safe materials — prevent static damage to sensitive semiconductor devices. Common ESD-safe materials: PEEK-CF30 (carbon-filled PEEK, surface resistance 10^4-10^6 Ω), conductive Delrin, specific ESD-safe machined plastics. We machine ESD-safe materials in dedicated ESD-safe area with documented material certification.

Semiconductor vacuum chambers require ultra-low outgassing components — trapped gases release slowly, contaminating processes. Critical for processes targeting atomic-layer purity. Materials: 316L electropolished, Vespel SP-1, OFE copper, specific UHV-qualified ceramics. Processing: thorough cleaning, vacuum bake-out at elevated temperature to drive off residuals. Our semiconductor parts meet sub-10^-10 mbar·L/s total outgassing.

Semiconductor equipment pushes precision limits. Typical: lithography stage features ±0.005 mm. Optical mount datums ±0.002 mm. Standard industrial: ±0.01-0.025 mm. We CMM-verify critical dimensions with temperature-compensated measurements. For sub-micron critical features, interferometric measurement through partner labs.

Common semiconductor-industry materials: 316L (chamber structural), Invar 36 (precision stages, low thermal drift), Mo-Cu composite (thermal management with CTE matching silicon), PEEK-CF30 (ESD-safe wafer handling), aluminum 6061 (general), specialty ceramics (aluminum oxide, silicon carbide — through partners). Material choice driven by specific application — chemistry, temperature, vacuum, cleanliness requirements.

Semiconductor programs typically plan 12-24 weeks ahead. Material sourcing for specialty alloys: 4-6 weeks. Machining: 4-8 weeks for complex work. Qualification testing and documentation: 2-6 weeks. Production programs: ongoing monthly deliveries with standing PO. For production equipment manufacturers (ASML, AMAT), supplier relationships are years-long with regular orders.