High-temperature refractory.
Semiconductor furnace.
1800 °C service.
Molybdenum serves where refractory metals are required — 1800 °C continuous service, low thermal expansion matching semiconductor materials, low activation for nuclear applications. Standard for semiconductor furnace hardware, glass melting electrodes, aerospace hot section.
Molybdenum variants.
Pure Mo for basic applications, TZM alloy for improved strength at temperature, Mo-Cu composite for semiconductor heat spreaders.
Pure Molybdenum
Commercially pure molybdenum. Standard refractory grade for furnace components, glass melting electrodes.
TZM Alloy
Mo with 0.5% Ti, 0.08% Zr. Higher strength at temperature than pure Mo. Aerospace hot section, forged tooling.
Mo-Cu Composite
Molybdenum matrix infiltrated with copper. CTE matches silicon and GaAs. Used for semiconductor heat spreaders, IC packaging.
Mo-Re Alloy
Molybdenum with rhenium for ductility. Used for thermocouple wire, nuclear applications.
Mo-La Alloy
Lanthanum oxide dispersed in Mo. Better creep resistance at high temperature. Used for glass industry, lighting filaments.
Mo Sheet
Rolled Mo sheet in thicknesses from 0.1 mm to 10 mm. Standard form for furnace shields, reflectors.
Why molybdenum.
Molybdenum occupies a niche: higher temperature than steel, lower cost than tungsten or tantalum, well-understood refractory metal.
High temperature
1800 °C continuous service — far beyond any steel or superalloy. Glass melting, semiconductor furnace, vacuum furnace hot zones.
Low thermal expansion
5.5 ppm/°C matches sapphire and silicon. Used for semiconductor packaging where CTE mismatch causes failures.
High thermal conductivity
138 W/m·K — 3× typical steel. Makes Mo-Cu heat spreaders effective for high-power semiconductors.
Low neutron cross-section
Nuclear applications — Mo is used where low neutron absorption matters (reactor structural, waste handling).
Molybdenum applications.
Semiconductor furnace
Silicon crystal growth hot zones, shields, susceptors — standard material for semiconductor fab equipment
Glass melting electrodes
Direct electrode heating of molten glass in specialty glass manufacturing
Vacuum furnace components
Hot zone structural components, radiation shields, support hardware
Sapphire growth
Crucibles for sapphire crystal growth for LEDs and watch glass
Aerospace hot section
Rocket engine components, hot structural parts in hypersonic applications
Semiconductor heat spreaders
Mo-Cu composite for high-power IC thermal management
Lighting filaments
High-temperature lighting filament hardware
X-ray anode
X-ray tube anode material for medical and industrial X-ray equipment
Nuclear fuel cladding
Specialty nuclear fuel cladding applications — low neutron absorption
Molybdenum finishing.
As-machined
Silver-grey. Brittle in air at room temperature — careful handling. Ra 1.6 µm typical.
Ground
Precision grinding for tight tolerances on Mo components.
Stress relief
Post-machining stress relief at 1200-1300 °C in hydrogen or vacuum reduces residual stress, prevents brittle fracture.
Vacuum cleaned
Ultrasonic + vacuum cleaning for semiconductor applications — zero contamination critical.
Welded
Electron beam or TIG welding in ultra-dry inert atmosphere. Mo absorbs oxygen catastrophically above 400 °C in air.
Brazed
Brazing in vacuum with nickel or copper-silver filler. Standard for joining Mo to dissimilar metals.
Polished
Mirror finish achievable. Used for radiation reflectors and optical-grade applications.
Coated
Silicide or aluminide coatings protect Mo from oxidation during use above 500 °C in air.
Molybdenum questions.
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