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Semiconductor Equipment

Ultra-clean. Low-particle.
Fab-ready.
ISO 8 handling.

Wafer handling fixtures, vacuum chamber components, process chamber shields, EMI enclosures. Semiconductor-grade aluminum, passivated 316L, electroless nickel plating. ISO 8 cleaning and double-bagged packaging standard.

01 · Parts we ship

Semiconductor part families.

Wafer handling fixtures

PEEK-ESD · Al 6061

End-effector tips, wafer tweezers, cassette hardware. Static-dissipative PEEK or anodized aluminum.

Process chamber shields

Anodized Al · 316L

Sacrificial liners, shield cans, deposition shields. Particle-optimized surface finish, hard-anodized.

Vacuum chamber bodies

316L · electropolish

UHV-compatible chamber shells, conflat flange machining, port hardware. Polished to Ra 0.4 µm.

Gas distribution plates

Al 6061 · passivated

Shower-head assemblies, gas diffusers with precision-drilled small-diameter holes. Low-particle finish.

E-chuck / pedestal bodies

Ceramic partner · Al

Machined aluminum bodies for electrostatic chucks. Ceramic top surfaces through partner.

EMI shielded enclosures

Al · Ni plated

Faraday-cage construction for RF-sensitive equipment. Conductive gasketing, continuous seam bonding.

Test socket hardware

BeCu · gold plated

Socket pins, probe card hardware, burn-in board components. High-temperature capable.

Robot arm components

Al 7075 · anodize

End-effectors, arm links, mounting brackets for wafer-handling robots.

Lithography tool parts

Low-thermal expansion

Precision-machined aluminum, Invar, or ceramic frames for step-and-repeat and scanner hardware.

FAQ

Semiconductor questions.

We provide ISO 8 (Class 100,000) cleaning and packaging as standard for semiconductor orders. For ISO 7 (Class 10,000) and better cleanliness, we partner with dedicated semiconductor cleaning specialists (Oneida, Entegris partners) for terminal cleaning. Parts are final-cleaned with DI water, IPA rinse, and packaged in nylon-cleaned double-bagging to prevent particle contamination.
Yes. Semiconductor-grade aluminum (tight composition control on trace copper, iron, and silicon for particle behavior) sourced through qualified mills. Full traceability with mill certificates. For etch chamber applications, we also source plasma-resistant grades like 6061-T6 UHP or anodized for reduced particle generation.
Quartz and fused silica machining is done through specialized glass machining partners — we do not machine quartz in-house. However, we regularly machine the metal mounting hardware that holds quartz components (chucks, frames, clamps, gas distribution plates). We coordinate glass+metal assemblies on a single PO.
Standard workflow. Machined aluminum or sheet metal chassis with EMI gasketing (finger stock, conductive elastomer), continuous electrical bonding across seams, Faraday-cage construction for RF-sensitive applications. Conductive paints and platings (electroless nickel, zinc) available for internal surface treatment.
Yes — a regular workstream. Process chamber shields, liners, and sacrificial components wear and require periodic replacement. We maintain CAD files for repeat orders and can ship replacements in 2–3 weeks with consistent quality. Anodized aluminum, 316L stainless, and plasma-resistant coatings available.
Yes. Surface finish, burr removal, and material selection all drive particle behavior in process chambers. We specify: bead-blasted uniform surfaces (not polished, which can release bead particles), passivated stainless (remove free iron), anodized aluminum (hard coat to prevent galling), electroless nickel plating for particle-sensitive components. All documented in the part's routing.
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